SMD disk varistors (CU varistors)
Automotive series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Test conditions
Criteria/ test results
Sn-Pb soldering
Pb-free soldering
Wettability
IEC
Immersion in
Immersion in
Covering of 95% of
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
end termination,
checked by visual
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
Thermal shock
(solder shock)
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC
Immersion in
Immersion in
Change of varistor
to soldering heat
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
voltage:
for SMDs
Tests of resistance IEC
at 260 ° C
Immersion
for 10 s at 260 ° C
Immersion
≤ ± 5%
Change of varistor
to soldering heat
for radial leaded
components
(SHCV)
60068-2-20
of leads in
60/40 SnPb
for 10 s at 260 ° C
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
voltage: ≤ ± 5%
Change of
capacitance X7R:
5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 21 of 30
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CU3225K17G2 制造商:EPCOS 制造商全称:EPCOS 功能描述:Ceramic transient voltage suppressors SMD disk varistors standard series
CU3225K17G2K1 功能描述:VARISTOR STD 17VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:250 系列:- 变阻器电压:750V 电流 - 浪涌:1.2kA 电路数:1 最大交流电压:460VAC 最大直流电压:615VDC 能量:63J 封装/外壳:圆盘 9mm 其它名称:2322 593 54616232259354616BC1419VDRS07H460BSC
CU3225K20G2 功能描述:VARISTOR STD 20VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm
CU3225K230G2 功能描述:VARISTOR STD 230VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm
CU3225K250G2 功能描述:VARISTOR STD 250VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 产品目录绘图:MOV-14DxxxK_20mm Height Series Front MOV-(07,10,14,20)D_4.8mm Thickness Series Side 标准包装:1,000 系列:- 变阻器电压:360V 电流 - 浪涌:4.5kA 电路数:1 最大交流电压:230VAC 最大直流电压:300VDC 能量:93J 封装/外壳:圆盘 14mm
CU3225K250G2K1 功能描述:VARISTOR STD 250VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:250 系列:- 变阻器电压:750V 电流 - 浪涌:1.2kA 电路数:1 最大交流电压:460VAC 最大直流电压:615VDC 能量:63J 封装/外壳:圆盘 9mm 其它名称:2322 593 54616232259354616BC1419VDRS07H460BSC
CU3225K25G2 功能描述:VARISTOR STD 25VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:400 系列:LU 变阻器电压:540V 电流 - 浪涌:6.5kA 电路数:1 最大交流电压:320VAC 最大直流电压:420VDC 能量:150J 封装/外壳:圆盘 20mm
CU3225K275G2 功能描述:VARISTOR STD 275VRMS 3225 SMD RoHS:是 类别:过电压,电流,温度装置 >> TVS - 变阻器,MOV 系列:CU 标准包装:3,000 系列:StandarD 变阻器电压:18V 电流 - 浪涌:1kA 电路数:1 最大交流电压:11VAC 最大直流电压:14VDC 能量:3.2J 封装/外壳:圆盘 14mm 其它名称:B72214S 110K151B72214S0110K151B72214S110K151